MMZ1005-E Gigaspira multi-layer gigahertz band chipbeads offer with the industry's highest impedance. Developed using original multi-layer technologies and ferrite material technologies, the new products extend to TDK's lineup EMC products suitable for eliminating noise over a wide band in the gigahertz range. In recent years, mobile devices such as mobile phones have incorporated numerous advanced functions in addition to the standard talk function such as terrestrial digital broadcast, FM broadcast reception and GPS functions. When they are used, each of these functions requires a different signal, and if radiated noise affects the reception antenna or high-frequency circuit units, reception sensitivity can deteriorate. Consequently, it is necessary to efficiently eliminate noise from high-density circuits and isolate each signal.
As mobile devices become smaller and smaller, there are increasing demands for space-saving solutions. In response to these market needs, TDK developed high-impedance products that can efficiently eliminate noise over a wide band using a ferrite chip.